News & Articles

Micron introduces new 12-high HBM3E Memory with 36 GB capacity and 1.2 TB/s bandwidth.

Micron introduces new 12-high HBM3E Memory with 36 GB capacity and 1.2 TB/s bandwidth.

Micron's HBM3E 12-high 36 GB memory solution offers superior performance, efficiency, and scalability for AI workloads, setting a new standard in the industry.

SK Hynix has developed the first 1c (10nm-class) DDR5 memory in the industry.

SK Hynix has developed the first 1c (10nm-class) DDR5 memory in the industry.

SK hynix has developed the industry's first 16 Gb DDR5 using its 1c node, marking a significant advancement in memory process technology with improved performance, cost competitiveness, and power efficiency for high-performance data centers.

KLEVV unveils CRAS V RGB DDR5 Memory Kits certified by ASUS ROG.

KLEVV unveils CRAS V RGB DDR5 Memory Kits certified by ASUS ROG.

KLEVV introduces the CRAS V RGB ROG-certified DDR5 Gaming Memory, a collaboration with ROG for mind-bending performance and supreme stability, perfect for hardcore gamers and PC enthusiasts seeking the best in memory technology.

SK hynix introduces its latest GDDR7 graphics memory.

SK hynix introduces its latest GDDR7 graphics memory.

SK hynix Inc. introduces industry-leading GDDR7 graphics memory product with improved speed and power efficiency, set to be adopted in high-end graphics cards and various applications including AI and autonomous driving.

Rambus is broadening its top-of-the-line memory interface chip selection to include DDR5 Client Clock Drivers for high-performance PCs.

Rambus is broadening its top-of-the-line memory interface chip selection to include DDR5 Client Clock Drivers for high-performance PCs.

Rambus Inc. introduces DDR5 Client Clock Driver for high-performance desktops and notebooks, bringing server technology advancements to the client market and enabling breakthrough memory performance in next-generation PCs.

Samsung is preparing to begin mass production of CXL 2.0 DRAM later this year.

Samsung is preparing to begin mass production of CXL 2.0 DRAM later this year.

Samsung Electronics Co. is set to mass-produce 256 GB DRAM supporting CXL 2.0 by the end of the year, with plans to significantly enhance high-performance server systems through the use of CXL technology, which promises to increase memory capacity per server by eight to ten times.

DDR5-6400 has been confirmed as the optimal speed for Ryzen 9000

DDR5-6400 has been confirmed as the optimal speed for Ryzen 9000 "Zen 5" desktop processors.

AMD's upcoming Ryzen 9000 series "Granite Ridge" desktop processors will feature improved memory overclocking capabilities, allowing for DDR5-6400 speeds with a 1:1 ratio between MCLK and FCLK domains.

Samsung, SK Hynix, and Micron vie for the top spot in the GDDR7 market.

Samsung, SK Hynix, and Micron vie for the top spot in the GDDR7 market.

Competition in the graphics DRAM market is heating up as Samsung, SK Hynix, and Micron race to enhance processing speed and efficiency with the introduction of next-generation GDDR7 memory, set to revolutionize AI accelerators and cryptocurrency mining.

During Computex 2024, G.SKILL Memory sets 31 overclock records.

During Computex 2024, G.SKILL Memory sets 31 overclock records.

During Computex 2024, G.SKILL set 31 overclock records using their memory and Intel platforms, with special thanks to top extreme overclockers and motherboard vendors ASRock, ASUS, GIGABYTE, and MSI.

Specifications for the ASUS ROG Ally X have been confirmed, including 24GB LPDDR5X-7500, M.2-2280, and an 80Wh battery.

Specifications for the ASUS ROG Ally X have been confirmed, including 24GB LPDDR5X-7500, M.2-2280, and an 80Wh battery.

The leaked specs sheet of the upcoming ASUS ROG Ally X handheld game console confirms a larger M.2 drive bay, 1 TB drive, 80 Wh battery, improved memory, and USB4 type-C connectivity, making it a significant upgrade from the ROG Ally Extreme.